Millisecond annealing (dsa) edge protection

ABSTRACT

A method and apparatus for thermally processing a substrate is provided. A substrate is disposed within a processing chamber configured for thermal processing by directing electromagnetic energy toward a surface of the substrate. An energy blocker is provided to block at least a portion of the energy directed toward the substrate. The blocker prevents damage to the substrate from thermal stresses as the incident energy approaches an edge of the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of co-pending U.S. patent applicationSer. No. 12/032,475, filed Feb. 15, 2008, which is herein incorporatedby reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments of the present invention generally relate to an apparatusand method for manufacturing a semiconductor device. More particularly,the invention is directed to an apparatus and method for thermallyprocessing a substrate.

2. Description of the Related Art

The integrated circuit (IC) market is continually demanding greatermemory capacity, faster switching speeds, and smaller feature sizes. Oneof the major steps the industry has taken to address these demands is tochange from batch processing silicon substrates in large furnaces tosingle substrate processing in a small chamber.

During single substrate processing, the substrate is typically heated toa high temperature to allow various chemical and physical reactions totake place in multiple IC devices defined in portions of the substrate.Of particular interest, favorable electrical performance of the ICdevices requires implanted regions to be annealed. Annealing recreates acrystalline structure from regions of the substrate that were previouslymade amorphous, and activates dopants by incorporating their atoms intothe crystalline lattice of the substrate. Thermal processes such asannealing require providing a relatively large amount of thermal energyto the substrate in a short amount of time, and then rapidly cooling thesubstrate to terminate the thermal process. Examples of thermalprocesses currently in use include Rapid Thermal Processing (RTP) andimpulse (spike) annealing. Conventional RTP processes heat the entiresubstrate even though the IC devices reside only in the top few micronsof the silicon substrate. This limits how fast one can heat and cool thesubstrate. Moreover, once the entire substrate is at an elevatedtemperature, heat can only dissipate into the surrounding space orstructures. As a result, today's state of the art RTP systems struggleto achieve a 400° C./s ramp-up rate and a 150° C./s ramp-down rate.While RTP and spike annealing processes are widely used, currenttechnology is not ideal because it ramps substrate temperature tooslowly during thermal processing, exposing the substrate to elevatedtemperatures for an extended period of time. These thermal budgetproblems become more severe with increasing substrate sizes, increasingswitching speeds, and/or decreasing feature sizes.

To resolve some of the problems raised in conventional RTP processes,various scanning laser anneal techniques have been used to annealsurfaces of substrates. In general, these techniques deliver a constantenergy flux to a small region on the surface of a substrate while thesubstrate is translated, or scanned, relative to the energy delivered tothe small region. Due to stringent uniformity requirements and thecomplexity of minimizing the overlap of scanned regions across thesubstrate surface, these types of processes are not effective forthermal processing contact level devices formed on the surface of thesubstrate.

Dynamic surface annealing (DSA) techniques have been developed to annealfinite regions on the surface of the substrate to provide well-definedannealed and/or re-melted regions on the surface of the substrate.Generally, during such laser anneal processes, various regions on thesurface of the substrate are sequentially exposed to a desired amount ofenergy delivered from the laser to cause the preferential heating ofdesired regions of the substrate. These techniques are preferred overconventional processes that sweep the laser energy across the surface ofthe substrate because the overlap between adjacent scanned regions isstrictly limited to the unused space between die, or “kurf,” lines,resulting in more uniform annealing across the desired regions of thesubstrate.

One disadvantage to DSA techniques is that annealing a portion of thesurface of the substrate subjects the interface region between annealedportions and non-annealed portions to high thermal stresses duringannealing due to temperature differences of up to 500° C. In most cases,these thermal stresses are relieved as heat conducts from the annealedregion into the non-annealed region of the substrate. However, as theannealing process moves toward an edge of the substrate, theavailability of heat-absorbing substrate domains is reduced by proximityto the edge, and thermal stresses cause physical deformation or breakageof the substrate. FIG. 1 illustrates an annealing process attempting toanneal a portion 102 of substrate 100 near its edge 104. Theelectromagnetic energy 106 radiating from source 108 heats portion 102,while edge portion 110 remains unheated. The interface area betweenannealed portion 102 and edge portion 110 develops high thermal stressdue to the relatively small heat-absorbing capacity of edge portion 110.This high thermal stress is frequently relieved by deformation orbreakage in edge portion 110 near edge 104 of substrate 100. Thus, thereis a need for a thermal processing apparatus and method capable ofannealing all desired regions of the substrate without damaging thesubstrate.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide an apparatus for processinga substrate in a processing chamber, comprising a substrate supportconfigured to position a substrate for processing, an energy sourceconfigured to direct electromagnetic energy toward the substratesupport, and one or more energy blockers configured to block at least aportion of the electromagnetic energy.

Other embodiments of the present invention provide a method ofprocessing a substrate in a processing chamber, comprising using asubstrate support to position the substrate in the processing chamber,directing electromagnetic energy toward at least a portion of thesubstrate, and blocking at least a portion of the electromagnetic energyfrom striking the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentinvention can be understood in detail, a more particular description ofthe invention briefly summarized above may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this invention and are therefore not to beconsidered limiting of its scope, for the invention may admit to otherequally effective embodiments.

FIG. 1 is a prior art representation of a thermal processing apparatusperforming thermal treatment of a substrate.

FIG. 2 is a cross-section view of an apparatus according to oneembodiment of the invention.

FIG. 2A is a detail view of a portion of the apparatus of FIG. 2.

FIG. 3 is a top view of an apparatus according to one embodiment of theinvention.

FIG. 3A is a detail view of a portion of the apparatus of FIG. 3.

FIG. 3B is a detail view of another portion of the apparatus of FIG. 3.

FIG. 4A is a cross-section view of an apparatus according to oneembodiment of the invention.

FIG. 4B is another cross-section view of an apparatus according to oneembodiment of the invention.

FIG. 5 is a perspective view of an apparatus according to anotherembodiment of the invention.

FIG. 6 is a cross-section view of an apparatus according to anotherembodiment of the invention.

DETAILED DESCRIPTION

Embodiments of the present invention provide an apparatus and method forthermal processing of a substrate. In a process chamber configured toperform thermal processes involving directing electromagnetic energytoward at least a portion of the surface of a substrate, a device isdeployed to block at least a portion of the electromagnetic energy fromreaching the substrate. The device is configured to allow insertion andremoval of the substrate by any of several means, and is made towithstand the conditions present during processing of the substrate.

FIG. 2 is a cross-section view of a thermal processing chamber 200according to one embodiment of the invention. Chamber 200 features awall 202, a floor 204, and a top portion 206 cooperatively defining aprocessing chamber. The processing chamber contains a substrate support208 for positioning a substrate in the chamber. The substrate support208 includes a conduit portion 210, which pierces floor 204, forcarrying various processing media to and from the substrate support.Conduit portion 210 may include passage 212 for carrying processingmedia to a surface of substrate support 208 through openings 214.Conduit portion 210 may also include passage 216 for carrying thermalcontrol media to channels inside substrate support 208, enablingsubstrate support 208 to be heated or cooled. For illustration purposes,a substrate 250 is shown disposed on substrate support 208.

A substrate may be introduced to chamber 200 through portal 218, whichmay be sealed by a door (not shown) if desired. Process gases may beintroduced to the process chamber through portal 220, and may beevacuated through portal 222, or through any other suitable conduit. Insome embodiments, it may be advantageous, for example, to evacuateprocess gases through a conduit in substrate support 208. In otherembodiments, gases may be provided to the back side of a substratedisposed on substrate support 208 through a conduit therein (not shown).Such gases may be useful for thermal control of the substrate duringprocessing in high vacuum. Thermal control gases are generally differentfrom process gases

Chamber 200 is generally juxtaposed with a source (not shown) fordirecting electromagnetic energy toward a substrate disposed in chamber200. Electromagnetic energy is admitted to the processing chamberthrough window 224 in top portion 206, which may be quartz or anothersuitable material, for transmitting electromagnetic energy whilewithstanding processing conditions. Chamber 200 also includes an energyblocker 226 configured to block at least a portion of theelectromagnetic energy coming from the source toward substrate support208.

Chamber 200 also includes a lift pin assembly 228 for manipulating theenergy blocker and the substrate inside the apparatus. In oneembodiment, lift pin assembly 228 comprises a plurality of lift pins 230for manipulating substrate 250 and a plurality of lift pins 232 formanipulating energy blocker 226. Lift pins may enter chamber 200 througha plurality of passages 234.

FIG. 2A is a detail view of portions of chamber 200. Window 224, energyblocker 226, and portal 220 are visible, as is lift pin assembly 228 ingreater detail. Lift pins 230 and 232 are guided by guide tubes 236,which ensure proper alignment of lift pins 230 and 232. In oneembodiment, lift pins 230 and 232 are enclosed by shuttles 246, whichcontact the inside of guide tubes 236 to maintain alignment of lift pins230 and 232 with guide tubes 236. Shuttles 246 may be any rigidmaterial, but will preferably have a low-friction surface for impingingon guide tube surfaces. In one embodiment, shuttles 246 may be ferriticstainless steel with plastic bushings (not shown) for contacting guidetubes 236. In some embodiments, lift pins 230 and 232 may be manipulatedby actuator collars 238, which are magnetically coupled to lift pins 230and 232 by shuttles 246, as shown in FIG. 2A. Actuator collars 238 areconfigured to travel in a longitudinal direction relative to guide tubes236, extending and retracting lift pins 230 and 232 as needed. Anactuator arm moves actuator collars 238 along guide tubes 236 to extendand retract lift pins. In this embodiment, a single actuator arm 240operates both sets of lift pins 230 and 232, but multiple actuators armsmay be used if desired. Extension of lift pin 232 into chamber 200 islimited by stop 242. A guide tube spring 244 may be provided as shown inFIG. 2A to allow actuator arm 240 to continue moving toward chamber 200after lift pin 230 has been curtailed by stop 242. In this way, lift pin230 may continue moving after lift pin 232 has stopped, with a singleactuator arm 240 moving both. In this embodiment, lift pin 232 is longerthan lift pin 230 to allow lift pin 232 to lift energy blocker 226before lift pin 230 lifts substrate 250 off of substrate support 208

Energy blocker 226 is configured to block a portion of theelectromagnetic energy directed toward substrate 250 through window 224.As will be seen in greater detail below, energy blocker 226 may beconfigured such that a portion rests on substrate support 208 whileanother portion extends above a portion of substrate support 208. Insome embodiments, energy blocker 226 casts a shadow over the edge of asubstrate disposed on substrate support 208. Energy blocker 226 may thusbe referred to as a shadow ring or an edge ring. Lift pins maymanipulate energy blocker 226 by mating with recesses.

In operation, lift pin 232 extends into the process chamber, liftingenergy blocker 226 above substrate support 208 a sufficient distance toallow manipulation of substrate 250 disposed on substrate support 208without contacting energy blocker 226. Lift pin 230 extends into theprocess chamber to lift substrate 250 above substrate support 208,allowing a substrate handling mechanism (not shown) to enter the processchamber through portal 218 (FIG. 2) and access the substrate. Asactuator 240 moves both lift pins upward, actuator collar 238A impingesstop 242. Actuator arm 240 continues moving, compressing guide tubespring 244 against actuator collar 238A, while actuator collar 238Bcontinues moving lift pin 230 upward. With a substrate handlingmechanism extended into the process chamber, actuator arm 240 retractslift pin 230 until guide tube spring 244 is fully extended, and thenretracts both lift pins 230 and 232 until substrate 250 and energyblocker 226 rests on substrate support 208. In this embodiment, with asingle actuator 240, lift pins 230 and 232 extend and retract together.In embodiments with multiple actuators, lift pin 232 may remain extendedwhen no substrate is disposed on substrate support 208. When a substrateis provided to the processing chamber by a handling mechanism, lift pin230 may then extend to lift the substrate above the handling mechanism,allowing the handling mechanism to retract from the processing chamberthrough portal 218 (FIG. 2). Lift pin 230 may then retract to disposethe substrate on substrate support 208. Lift pin 232 may then retract todispose energy blocker 226 in a processing position.

To remove a substrate from the chamber, lift pins 230 and 232 operate inreverse. In a single-actuator embodiment, both lift pins extend into theprocess chamber. Lift pin 232 engages energy blocker 226 first,elevating it above substrate support 208. Lift pin 230 engages substrate250 a short time later, and both ascend above substrate support 208 byoperation of the lift pins 230 and 232. When actuator collar 238Areaches stop 242, lift pin 232 stops ascending, and guide tube spring244 compresses as actuator arm 240 continues moving upward. As actuatorarm 240 continues moving upward, lift pin 230 continues to move, whilelift pin 232 remains stationary. Thus, substrate 250, supported by liftpins 232, approaches energy blocker 226. When collar 238B reaches theupper extremity of guide tube 236, actuator arm 240 and lift pin 230stop moving. A substrate handling apparatus may then extend into theprocess chamber. The actuator arm may then descend, lowering substrate250 onto the substrate handling apparatus for withdrawal from thechamber. In multiple-actuator embodiments, lift pin 232 may remain fullyextended while substrate 250 is manipulated from substrate support 208to substrate handling apparatus, and while a new substrate ismanipulated onto substrate support 208, if desired.

FIG. 3 is a top view of an apparatus according to one embodiment of theinvention. FIG. 3 illustrates one embodiment of an energy blocker 300 asdescribed above. In some embodiments, the energy blocker 300 is aradiation blocker. In this embodiment, energy blocker 300 is a ring,annular in shape and formed as a single article, configured to blocksome energy being directed toward substrate support 208. In someembodiments, energy blocker 300 may be opaque, while in otherembodiments energy blocker 300 may be partially transparent to somefrequencies of electromagnetic energy used to anneal the substrate whileblocking other frequencies. In this embodiment, substrate support 208features openings 302 to allow lift pins 230 (FIGS. 2 and 2A) to deployfrom beneath substrate support 208 to manipulate a substrate disposedthereon. In this embodiment, energy blocker 300 features tabs 304 formating with lift pins 232 (FIGS. 2 and 2A). The lift pins move energyblocker 300 to allow for translation of a substrate inside the processchamber. Energy blocker 300 also features alignment points 306 foraligning energy blocker 300 with substrate support 208.

FIG. 3A is a detail view of a portion of the apparatus of FIG. 3. Asection of the energy blocker 300 is shown, in which the lift pin tab304 and alignment point 306 are visible. Also visible is the substratesupport 208 and opening 302 therein, with lift pin 230 shown in itsextended position. Lift pin 232 is also shown in its extended position,mating with tab 304. In this embodiment, lift pin 232 mates with tab 304by virtue of recess 310. In this embodiment, the lift pins and recesseshave a circular cross-sectional shape, but in other embodiments they mayhave any shape, such as square, rectangular, triangular, oval, and thelike. Additionally, although the embodiment of FIG. 3 features threetabs for three lift pins, any convenient number of lift pins may beused, so long as an energy blocker can be adequately manipulated. Inthis embodiment, alignment point 306 is a tapered pin projectingdownward from energy blocker 300 and mating with notch 312. From the topof energy blocker 300, alignment point 306 appears as a recess in theupper surface of energy blocker 300. Any arrangement and number ofalignment points 306 designed to ensure alignment of energy blocker 300with substrate support 208 may be used. For example, alignment pins maybe disposed on substrate support 208 pointing upward into recessesformed in energy blocker 300. Alignment of energy blocker 300 withsubstrate support 208 ensures that the desired portions of a substratedisposed on substrate support 208 are shielded from electromagneticradiation.

In the embodiment illustrated by FIG. 3A, notch 312 is aligned withindentation 314 to allow lift pin 232 to travel freely past substratesupport 208 and engage with recess 310 in tab 304. FIG. 3B shows analternate embodiment in which alignment point 306 is displaced fromindentation 314. In both embodiments illustrated by FIGS. 3A and 3B,energy blocker 300 has a rounded or beveled edge 316. Alignment point306 also has a rounded or beveled edge 318 on the upper surface ofenergy blocker 300. In these two embodiments, edge 318 of alignmentpoint 306 is shown substantially tangent to the inner extremity ofrounded or beveled edge 316 of energy blocker 300. Alternate embodimentsmay, however, include alignment features located at any convenientpoint. For the two illustrated embodiments, alignment points 306 may belocated a distance approximately halfway between the inner and outeredge of energy blocker 300, or substantially tangent to the inner edge.

FIG. 4A is a cross-section view of an apparatus according to oneembodiment of the invention. In this embodiment, energy blocker 300 isshown in a spaced-apart configuration relative to substrate support 208.Lift pin 232 is visible mating with recess 310 in tab 304, as describedabove. Alignment point 306 is illustrated in this embodiment as afrustroconical pin 406 projecting downward from energy blocker 300 formating with notch 312, with no corresponding recess in the upper surfaceof energy blocker 300. In operation, the energy blocker of thisembodiment is configured to rest on substrate 208 during processing.Energy blocker 300 features cutaway portion 408 designed to remainspaced apart from substrate support 208 when energy blocker 300 rests onsubstrate support 208. Cutaway portion 408 is sized such that extension410 extends over a portion of a substrate disposed on substrate support208 during processing. Extension 410 thus creates a shadow over aportion of a substrate resting on substrate support 208, preventingelectromagnetic energy from impinging the substrate too close to itsedge. In this way, energy blocker 300 with extension 410 protects theedge of a substrate disposed on substrate support 208 from deformationor damage due to extreme thermal stresses during processing. Energyblocker 300 is thus sometimes referred to as a shadow ring or an edgering. FIG. 4B illustrates an alternate embodiment, as in FIG. 3B,wherein notch 312 is not aligned with indentation 314.

In the embodiment of FIG. 4A, energy blocker 300 may be up to about 5millimeters (mm) thick at its thickest point. Cutaway portion 408 mayreduce thickness by up to about 80%, resulting in thickness of extension410 less than about 3 mm. Extension 410 may create a shadow on thesubstrate up to about 3 mm from an edge of the substrate. Clearancebetween extension portion 410 and a substrate resting on substratesupport 208 may be less than about 2 mm during processing. Energyblocker 300 may be made of any material capable of withstandingprocessing conditions, but is preferably made of alumina (aluminumoxide, AI_(x)O_(y), where the ratio of y/x is from about 1.3 to about1.7), aluminum nitride (AIN), quartz (silicon dioxide, SiO₂), or siliconcarbide (SiC), most preferably from alumina. These materials may be usedto make an energy blocker that is opaque or that transmits some or allelectromagnetic energy incident thereon.

FIG. 5 illustrates an alternative embodiment of the invention. A lowerportion 500 of a processing chamber is visible. An energy blocker 502 isshown disposed above a substrate support surface 504. Substrate supportsurface 504 features holes 516 for delivering processing media toportions of a substrate disposed on support surface 504. Energy blocker502 features a plurality of tabs 506 extending from an outer edge ofenergy blocker 502. In this embodiment, energy blocker 502 is a ring,annular in shape and formed as a single article, configured to blockelectromagnetic energy from reaching at least a portion of a substratedisposed on support surface 504. Energy block 502 may be a shadow ringor an edge ring. Energy blocker 502 also features a plurality ofalignment points 508, configured as holes in energy blocker 502 formating with pins 510 disposed on chamber lower portion 500. In thisembodiment, energy blocker 502 is manipulated by lift arms 512, whichextend beneath the plurality of tabs 506. Lift arms 512 are actuated bylift pins 514, which move lift arms 512 in a vertical direction,enabling lift arms 512 to contact tabs 506 and lift energy blocker 502thereby. In this embodiment, energy blocker 502 may comprise anymaterial capable of blocking the desired energy and withstanding processconditions. Some preferable materials are discussed above. Energyblocker 502 may be opaque or may transmit some or all electromagneticenergy incident thereon.

Other embodiments of the invention are contemplated, although notillustrated in figures. An annular energy blocker such as thosedescribed above may be formed from two or more detachable parts, whichmay be coupled and uncoupled at convenient times during processingcycles. For example, two or more ring parts may be coupled to form aradiation blocker for a process chamber. During processing, the ringparts may rest on a substrate support to block electromagnetic energyfrom reaching at least a portion of a substrate disposed on the support.When a substrate is inserted or withdrawn from the process chamber, thering parts may retract vertically or laterally to allow access to thesubstrate. For example, three ring parts may each be coupled to aretractor designed to move each ring part a set distance laterally toallow clearance for a substrate to be lifted above the substratesupport.

FIG. 6 illustrates another embodiment of the invention. A substratesupport 600 is visible, with an energy blocker 602. A support ring 604is provided in this embodiment for restraining energy blocker 602 whenit is not in contact with substrate support 600. When the two are incontact, energy blocker 602 rests on substrate support 600. Alignment isachieved by virtue of pins 606 on substrate support 600, which areconfigured to mate with recesses 608 in energy blocker 602. In thisembodiment, pins 606 are shown as frustroconical extensions protrudingfrom substrate support 600, and configured to insert into recesses 608with similar shape. In alternate embodiments, however, pins 606 andrecesses 608 may have any convenient shape, such as rounded, square,triangular, and the like.

In operation, the apparatus of FIG. 6 functions to passively disposeenergy blocker 602 on substrate support 600 during processing. Substratesupport 600 will generally be movable in this embodiment, raising andlowering inside the process chamber to facilitate insertion andwithdrawal of substrates. When a substrate is disposed on substratesupport 600, it raises into a processing position. As substrate support600 rises, pins 606 contact and mate with recesses 608, lifting energyblock 602 from support ring 604. Extension 610 of energy blocker 602extends above a portion of the substrate disposed on support 600 byvirtue of cutaway portion 612, and blocks a portion of electromagneticenergy being directed toward the substrate. In some embodiments, energyblocker 602 may be a shadow ring or an edge ring. After processing,substrate support 600 lowers into a substrate transfer position. Energyblocker 602 rests on support ring 604 and disengages from support 600,creating space for withdrawal of the substrate.

Energy blockers as described herein may also be useful as a method ofshielding measurement devices from unwanted radiation inside a processchamber. Devices are commonly deployed inside a process chamber tomeasure various parameters during processing. In many cases, thesedevices are sensitive to electromagnetic radiation, and may sufferinaccuracy or damage from energy directly incident from the energysource. An energy blocker as described herein may be used to preventenergy from the source directly impinging measurement devices. Forexample, in some embodiments, temperature measurement devices, such aspyrometers, may be disposed inside a processing chamber for measuringthe temperature of a substrate by sensing electromagnetic energyradiated by the substrate. Such instruments would be inaccurate ifenergy directly from the source were to impinge on them. A radiationblocker such as that described herein may block at least a portion ofelectromagnetic energy that might otherwise impinge directly on thedevice.

While the foregoing is directed to embodiments of the present invention,other and further embodiments of the invention may be devised withoutdeparting from the basic scope thereof, and the scope thereof isdetermined by the claims that follow.

1. A method of thermally processing a substrate in a processing chamber,comprising: positioning the substrate on a substrate support in theprocessing chamber; directing electromagnetic energy toward thesubstrate; and positioning an energy blocker to block at least a portionof the electromagnetic energy from striking an edge of the substratewhile exposing the center of the substrate to the electromagneticenergy.
 2. The method of claim 1, wherein the positioning an energyblocker comprises using alignment points to align the energy blockerwith the substrate support.
 3. The method of claim 2, wherein the energyblocker rests on the substrate support.
 4. The method of claim 3,wherein a portion of the energy blocker is positioned less than about 2millimeters from the substrate.
 5. The method of claim 1, wherein theenergy blocker creates a shadow on the substrate up to about 3millimeters from the edge of the substrate.
 6. A method of thermallyprocessing a substrate in a processing chamber, comprising: positioningthe substrate on a substrate support in the processing chamber;directing electromagnetic energy toward the substrate; and lowering anenergy blocker to contact the substrate support, the energy blockerconfigured to block at least a portion of the electromagnetic energyfrom striking an edge of the substrate while exposing the center of thesubstrate to the electromagnetic energy.
 7. The method of claim 6,further comprising: exposing the center of the substrate toelectromagnetic radiation; then elevating the energy blocker; and thenremoving the substrate from the processing chamber.
 8. The method ofclaim 7, wherein the elevating the energy blocker comprises actuating afirst set of lift pins disposed below the energy blocker, and whereinthe removing the substrate comprises: actuating a second set of liftpins; and retracting the substrate from the processing chamber with ahandling mechanism.
 9. The method of claim 8, wherein the first set oflift pins and the second set of left pins are actuated with a singleactuator.
 10. The method of claim 6, wherein the energy blockercomprises alumina, aluminum nitride, quartz, or silicon carbide.
 11. Themethod of claim 6, wherein the lowering an energy blocker furthercomprises inserting a pin coupled to the substrate support into a recesswithin the energy blocker to align the energy blocker with the substratesupport.